Auto Patch Pick and Place Machine | Automatic Card Component

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Update time : 2026-07-16

Auto Patch Pick and Place Machine for Smart Card Production

The ZOWINDA Auto Patch Pick and Place Machine is engineered for high-precision placement of RFID inlays, chips, and adhesive patches onto card sheets, modules, and inlay substrates. It bridges the gap between manual bonding and fully automated inlay lines, delivering consistent placement accuracy at production scale for smart card, RFID tag, and NFC inlay manufacturers.

Key Features

Vision-guided alignment with sub-millimeter positioning accuracy
Multi-head simultaneous pick-and-place for throughput up to 3,000+ units/hour
Compatible with RFID wet inlays, dry inlays, PCB antennas, and pre-laminated patches
Automatic feeder with anti-stick and anti-double-sheet detection
Recipe management for fast changeover between card layouts and patch types
Integrated reject station for misplaced or missing components

Technical Specifications

Parameter	Specification
Placement Accuracy	±0.1 mm
Throughput	3,000 – 4,500 units/hour (model dependent)
Substrate Size	CR80 / ISO 7810 card, max 110 × 80 mm
Component Types	RFID inlay, chip module, adhesive patch
Vision System	CCD camera, ±5 μm repeatability
Power Supply	AC 220V / 50-60 Hz
Air Supply	0.5 – 0.7 MPa clean dry air
Machine Weight	approx. 480 kg

Application Scenarios

Ideal for contactless card inlay manufacturing, dual-interface card production, RFID label embedding, and sample bonding workflows where precise patch positioning directly impacts yield and read performance.