Auto Patch Pick and Place Machine for Smart Card Production

Auto Patch Pick and Place Machine for Smart Card Production

The ZOWINDA Auto Patch Pick and Place Machine is engineered for high-precision placement of RFID inlays, chips, and adhesive patches onto card sheets, modules, and inlay substrates. It bridges the gap between manual bonding and fully automated inlay lines, delivering consistent placement accuracy at production scale for smart card, RFID tag, and NFC inlay manufacturers.

Key Features

• Vision-guided alignment with sub-millimeter positioning accuracy
• Multi-head simultaneous pick-and-place for throughput up to 3,000+ units/hour
• Compatible with RFID wet inlays, dry inlays, PCB antennas, and pre-laminated patches
• Automatic feeder with anti-stick and anti-double-sheet detection
• Recipe management for fast changeover between card layouts and patch types
• Integrated reject station for misplaced or missing components

Technical Specifications

Application Scenarios

Ideal for contactless card inlay manufacturing, dual-interface card production, RFID label embedding, and sample bonding workflows where precise patch positioning directly impacts yield and read performance.