Auto Contactless Card Inlay Sheet Manufacturing Line

Short Description:

Eliminate manual steps with our automated inlay line. From sheet feeding to pre-lam stack output, processes include vision chip placement, CAD-based embedding, and in-line testing. Compact, efficient, and consumable-free.


Product Details

Product Tags

Product Overview

The ZWD-AFJX-4000 Auto Inlay Production Line is a groundbreaking, end-to-end automated manufacturing system engineered for the complete, uninterrupted production of high-quality contactless card inlay sheets. This integrated line consolidates all critical processes — from chip placement and antenna embedding to welding, testing, and sheet collation — into a single, seamless, and fully automated workflow. Designed to eliminate manual handling, reduce consumables, and maximize precision, it represents the pinnacle of efficiency and reliability for high-volume manufacturers of RFID, NFC, and smart card inlays.

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Core Functionality & Integrated Process

The production line executes a sophisticated, continuous sequence:

  1. Automated Sheet Feeding: A liftable loading cart with air-blowing separation ensures single-sheet feeding, preventing double picks. Motorized height control and sensors guarantee precise entry into the line.

  2. Precision Sheet Transfer & Positioning: Suction cup modules transfer sheets between stations. Dedicated pre-positioning and correction stations use air cylinder systems and fiber optic detection to ensure each sheet is perfectly aligned before processing, with automatic double-sheet alarms.

  3. Vision-Guided Chip Placement:

    • Chips are oriented via a flexible vibration tray and located by a high-precision vision system.

    • A servo-driven pick-and-place mechanism, with vacuum nozzles featuring real-time suction detection, places chips with exceptional accuracy.

    • Each chip position on the vacuum plate is protected by an independent hard block to prevent damage during subsequent welding.

  4. Ultrasonic Antenna Wire Embedding:

    • Utilizes ultrasonic generators for reliable wire embedding onto a vacuum-held sheet, ensuring flatness and consistency.

    • Integrated wire breakage detection monitors the process in real-time, triggering alarms and stops if anomalies occur.

    • The software supports direct import of customer CAD files, allowing for custom antenna patterns. Speed and jumper height for each wire segment are independently adjustable.

  5. Inverter Resistance Welding:

    • Employs servo-controlled inverter resistance welding tips for precise, consistent connections.

    • Features an automatic self-cleaning function where tips are polished by steel brushes and sandpaper, reducing maintenance downtime and cost.

  6. In-Line Automated Testing:

    • An integrated test station automatically identifies non-functional (NG) inlays.

    • Defective sheets are marked and diverted to a reject collection station, while good sheets proceed.

  7. Sheet Collating & Spot Welding:

    • Correctly positions and stacks multiple tested inlay sheets using air cylinders.

    • Uses high-efficiency ultrasonic welding to create stable pre-laminate stacks.

    • The collating sequence, sheet count per stack, and weld points are fully configurable. A thickness detection device prevents stacking errors.

  8. Automatic Collection & Unloading:

    • X and Y-axis transfer units automatically collect finished pre-lam stacks.

    • Once full, stacks are transferred to a mobile unloading cart, ready for the next lamination process.

Key Features & Advantages

  • True End-to-End Automation: From blank sheet feeding to finished pre-lam stack output, the entire process requires minimal operator intervention (only for bulk loading/unloading), dramatically reducing labor costs and human error.

  • Consumable-Free Process: Eliminates the need for green tape or glue, significantly lowering ongoing production costs and material handling.

  • Uncompromised Precision & Yield: Performing chip placement, embedding, and welding in a single pass ensures unparalleled positional accuracy of chips relative to the antenna, directly improving the final card's functional yield and performance.

  • Intelligent Process Control & Monitoring:

    • Professional PC + PLC + Servo Control: Ensures perfect coordination between all stations for smooth, high-speed cyclic operation with zero inter-station downtime.

    • Comprehensive Sensing: Includes double-sheet detection, vacuum pick-up monitoring, wire breakage detection, and thickness verification, ensuring process integrity.

  • High Flexibility & Customization: Supports custom antenna graphics via CAD import and allows for independent parameter adjustment at most stations. The line's modular design supports upgrades and customization for different products.

  • Compact & Robust Design: Integrates a complex production line into a space-efficient footprint (4850x340x225 cm), built for 24/7 stable operation.

Technical Specifications

ParameterSpecification
ModelZWD-AFJX-4000
Dimensions (L x W x H)4850 x 340 x 225 cm
WeightApproximately 4000 kg
Power SupplyAC 380V, 50 Hz
Power Consumption20 KW
Compressed Air0.6 MPa, Consumption: 400 L/min
Typical Production Capacity2000 Chips/Hour (Speed depends on layout & parameters)
Control SystemPC + PLC + Servo System
Operator Requirement1 Person

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Applications

This production line is the ideal solution for manufacturers of:

  • RFID Inlays & Tags for inventory, logistics, and retail.

  • Contactless Smart Card Inlays for payment, access control, and identification.

  • NFC Antenna Modules for consumer electronics and IoT devices.

  • High-Security Document Inlays for e-passports and national IDs.

Why Choose the ZWD-AFJX-4000?

For any manufacturer serious about scale, quality, and cost-efficiency in inlay production, the ZWD-AFJX-4000 is a transformative investment. It replaces multiple standalone machines and manual assembly stages with a single, synchronized, and intelligent production line. By guaranteeing accuracy through integrated processing and eliminating consumables, it not only boosts throughput but also significantly improves product consistency and reduces total cost of ownership.

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