Automatic IC Module Implanting Machine
Product Overview
The ZWD-IC-501 Automatic IC Module Implanting Machine represents a sophisticated, all-in-one automation solution engineered for the high-volume and high-precision production of smart cards. This integrated system seamlessly combines the critical processes of glue application, module punching, precise implantation, and post-implantation electrical testing into a single, continuous workflow. Designed specifically to implant strip-form IC modules into pre-milled cavities on standard ISO cards, it is the cornerstone of modern contact and dual-interface smart card manufacturing lines, ensuring superior efficiency, accuracy, and reliability.

Core Process & Integration
The machine automates the complete module implantation sequence:
Card Handling: Utilizes dual magazines for continuous, automatic loading and unloading of card bases (PVC, ABS, PET-G).
Cavity Verification: Automatically inspects the pre-milled cavity for dimensional accuracy before proceeding.
Glue Application: Applies a precise amount of adhesive to the prepared strip module.
Module Punching & Preparation: Punches the individual module from the carrier tape.
Precision Implantation: Implants the module into the card cavity with high positional accuracy (X, Y = ±0.03mm) under controlled pressure (3-6 Kg/cm²).
Secure Encapsulation: Performs a robust three-stage encapsulation process:
Spot Welding: For initial module positioning.
Hot Welding (Stations A & B): For primary bonding at adjustable temperatures (100°C – 300°C).
Cold Lamination: For final surface finishing and durability.
Comprehensive Testing & Sorting:
Dual-Interface Testing: Verifies the electrical connectivity of the coil for contactless functionality.
ATR (Answer To Reset) Detection: Performs a fundamental electrical test on the implanted module.
Defect Management: Automatically identifies and ejects cards with damaged modules, failed welds, or electrical faults into separate waste/reject boxes.
Key Features & Advantages
All-in-One Integrated Processing: Consolidates gluing, punching, implanting, welding, and testing into one machine, drastically reducing work-in-progress and floor space.
High Precision & Speed: Achieves an implantation accuracy of ±0.03mm at speeds up to 3,000 Units Per Hour (UPH), ensuring consistent quality in mass production.
Intelligent Quality Control: Integrated vision or sensor systems automatically check for cavity defects and identify damaged modules before implantation, preventing waste.
Dual-Interface Card Compatibility: Specifically equipped to handle and test both contact and contactless (dual-interface) smart cards.
Flexible & Adaptable Design: Allows for quick changeover of glue preparation and punching modules to accommodate different IC module types and form factors.
User-Friendly Operation: Features a PLC-controlled system with a multi-language (Chinese/English) touchscreen interface for intuitive setup, monitoring, and control.
Robust Construction: Built for industrial endurance with a stable frame (1200kg) designed for continuous operation in a controlled environment.
Technical Specifications
| Parameter | Specification |
|---|---|
| Model | ZWD-IC-501 |
| Maximum Speed | 3,000 UPH |
| Implantation Accuracy (X, Y) | ± 0.03 mm |
| Implantation Pressure | 3 – 6 Kg/cm² |
| Encapsulation Temperature | 100°C – 300°C (Adjustable) |
| Power Supply | AC 220V, 50/60 Hz |
| Power Consumption | 1.5 KW |
| Air Consumption | 250 L/min |
| Dimensions (L x W x H) | 1960 x 800 x 2050 mm |
| Weight | 1200 kg |
| Suitable Card Material | ISO 7816 Standard Cards (PVC, ABS, PET-G) |
| Operating Environment | Temperature: 22°C ±3°C; Dry, Dust-Free |

Applications
This machine is essential for manufacturers of:
Financial Cards: Credit, debit, and ATM cards.
Identification Cards: National ID cards, corporate access badges, and student cards.
Dual-Interface Cards: Next-generation cards supporting both contact and contactless (e.g., EMV, NFC) transactions.
SIM Cards and Telecom Modules.
Any application requiring high-precision, high-volume implantation of IC modules into plastic card bodies.
Why Choose the ZWD-IC-501?
In the competitive smart card market, production speed, yield rate, and card durability are critical. The ZWD-IC-501 addresses these needs directly by offering a closed-loop automated process that minimizes human error, maximizes throughput, and embeds rigorous quality checks at every stage. Its ability to handle dual-interface cards and its flexible design make it a future-proof investment for card manufacturers looking to scale production and adapt to evolving technology standards.
Customization & Support
The machine supports adjustments for different module types. Comprehensive installation, training, and technical support services are provided to ensure optimal integration and performance in your production facility.











