Automatic IC Module Implanting Machine

Short Description:

Fully automated solution for implanting IC modules into smart cards. Features dual card magazines, cavity check, ATR testing, and hot/cold encapsulation. Processes PVC, ABS, PET-G at 3000 cards/hour.


Product Details

Product Tags

Product Overview

The ZWD-IC-501 Automatic IC Module Implanting Machine represents a sophisticated, all-in-one automation solution engineered for the high-volume and high-precision production of smart cards. This integrated system seamlessly combines the critical processes of glue application, module punching, precise implantation, and post-implantation electrical testing into a single, continuous workflow. Designed specifically to implant strip-form IC modules into pre-milled cavities on standard ISO cards, it is the cornerstone of modern contact and dual-interface smart card manufacturing lines, ensuring superior efficiency, accuracy, and reliability.

Automatic IC Module Implanting Machine(pic1)

Core Process & Integration

The machine automates the complete module implantation sequence:

  1. Card Handling: Utilizes dual magazines for continuous, automatic loading and unloading of card bases (PVC, ABS, PET-G).

  2. Cavity Verification: Automatically inspects the pre-milled cavity for dimensional accuracy before proceeding.

  3. Glue Application: Applies a precise amount of adhesive to the prepared strip module.

  4. Module Punching & Preparation: Punches the individual module from the carrier tape.

  5. Precision Implantation: Implants the module into the card cavity with high positional accuracy (X, Y = ±0.03mm) under controlled pressure (3-6 Kg/cm²).

  6. Secure Encapsulation: Performs a robust three-stage encapsulation process:

    • Spot Welding: For initial module positioning.

    • Hot Welding (Stations A & B): For primary bonding at adjustable temperatures (100°C – 300°C).

    • Cold Lamination: For final surface finishing and durability.

  7. Comprehensive Testing & Sorting:

    • Dual-Interface Testing: Verifies the electrical connectivity of the coil for contactless functionality.

    • ATR (Answer To Reset) Detection: Performs a fundamental electrical test on the implanted module.

    • Defect Management: Automatically identifies and ejects cards with damaged modules, failed welds, or electrical faults into separate waste/reject boxes.

Key Features & Advantages

  • All-in-One Integrated Processing: Consolidates gluing, punching, implanting, welding, and testing into one machine, drastically reducing work-in-progress and floor space.

  • High Precision & Speed: Achieves an implantation accuracy of ±0.03mm at speeds up to 3,000 Units Per Hour (UPH), ensuring consistent quality in mass production.

  • Intelligent Quality Control: Integrated vision or sensor systems automatically check for cavity defects and identify damaged modules before implantation, preventing waste.

  • Dual-Interface Card Compatibility: Specifically equipped to handle and test both contact and contactless (dual-interface) smart cards.

  • Flexible & Adaptable Design: Allows for quick changeover of glue preparation and punching modules to accommodate different IC module types and form factors.

  • User-Friendly Operation: Features a PLC-controlled system with a multi-language (Chinese/English) touchscreen interface for intuitive setup, monitoring, and control.

  • Robust Construction: Built for industrial endurance with a stable frame (1200kg) designed for continuous operation in a controlled environment.

Technical Specifications

ParameterSpecification
ModelZWD-IC-501
Maximum Speed3,000 UPH
Implantation Accuracy (X, Y)± 0.03 mm
Implantation Pressure3 – 6 Kg/cm²
Encapsulation Temperature100°C – 300°C (Adjustable)
Power SupplyAC 220V, 50/60 Hz
Power Consumption1.5 KW
Air Consumption250 L/min
Dimensions (L x W x H)1960 x 800 x 2050 mm
Weight1200 kg
Suitable Card MaterialISO 7816 Standard Cards (PVC, ABS, PET-G)
Operating EnvironmentTemperature: 22°C ±3°C; Dry, Dust-Free

Automatic IC Module Implanting Machine(pic2)

Applications

This machine is essential for manufacturers of:

  • Financial Cards: Credit, debit, and ATM cards.

  • Identification Cards: National ID cards, corporate access badges, and student cards.

  • Dual-Interface Cards: Next-generation cards supporting both contact and contactless (e.g., EMV, NFC) transactions.

  • SIM Cards and Telecom Modules.

  • Any application requiring high-precision, high-volume implantation of IC modules into plastic card bodies.

Why Choose the ZWD-IC-501?

In the competitive smart card market, production speed, yield rate, and card durability are critical. The ZWD-IC-501 addresses these needs directly by offering a closed-loop automated process that minimizes human error, maximizes throughput, and embeds rigorous quality checks at every stage. Its ability to handle dual-interface cards and its flexible design make it a future-proof investment for card manufacturers looking to scale production and adapt to evolving technology standards.

Customization & Support
The machine supports adjustments for different module types. Comprehensive installation, training, and technical support services are provided to ensure optimal integration and performance in your production facility.


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