Zowinda ZWD-AFJX-1000 Integrated Inlay Manufacturing System

Overview
The Zowinda ZWD-AFJX-1000 represents a significant advancement in contactless device manufacturing, integrating three critical production stages into a single automated platform. This all-in-one system addresses the growing demand for efficient inlay production in the smart card, RFID, and electronic passport industries by combining chip placement, wire embedding, and welding operations within one coordinated workflow.

Technical Process Integration
The system performs sequential operations through a precisely timed mechanical ballet. PVC substrate material feeds automatically into the processing area where eight independently controlled placement heads position COB chips with ±0.05mm accuracy. These heads interface with a flexible vibration system that orients chips before transfer, eliminating manual handling completely.

Following chip placement, eight ultrasonic embedding heads deploy proprietary wire positioning technology. Each head operates with individual Z-axis servo control while a vacuum stabilization platform maintains substrate integrity during the embedding process. The system accepts standard CAD files (DXF format) for custom antenna patterns, with programmable segment speeds and jumper height adjustments from 0.1 to 1.0mm.

The final welding stage utilizes four servo-positioned heads employing dual-pulse high-frequency inverter technology. What sets this system apart is the independent parameter control for each welding position, allowing material-specific optimization across different substrate zones. This granular control ensures consistent bond quality regardless of material variations.

Production Efficiency Enhancements
Conventional inlay manufacturing typically requires separate workstations connected by manual transfer processes, creating bottlenecks and quality control challenges. The LDT-AFJX-1000 eliminates these transitions through continuous automated workflow. The system's most notable innovation is the complete elimination of green tape—a standard consumable in traditional inlay production—resulting in measurable cost reduction estimated at $0.02-$0.05 per unit depending on production volume.

The equipment processes 2,000-2,200 sheets hourly in standard configurations (3×8 or 4×8 layouts), though custom configurations are available. Material changeovers occur without production interruption, with the system capable of switching between different inlay designs through software commands rather than mechanical adjustments.

Engineering Design Principles
Structural rigidity receives particular attention in the machine's construction. The 3,000kg frame dampens vibration even at maximum operating speeds, while the servo-driven positioning systems maintain precision throughout extended production runs. The human-machine interface incorporates a 15-inch touchscreen with intuitive workflow programming, reducing operator training requirements significantly.

Quality Assurance Features
Each production module includes integrated self-diagnostic capabilities that monitor performance metrics in real-time. The system logs production data including placement accuracy, embedding pressure consistency, and weld quality parameters. This data collection supports both immediate quality control and long-term process optimization.

Modular Expansion Capabilities
The platform design accommodates several upgrade paths. Available enhancements include integrated optical inspection systems, automated sheet collation modules, and additional spot welding capacity. The control architecture supports custom function development based on specific production requirements, ensuring the system adapts to evolving manufacturing needs.

Technical Specifications

• Dimensions: 3700 × 3250 × 1850 mm (L×W×H)

• Weight: 3000 kg

• Power Requirements: 380V/50Hz, 8kW nominal consumption

• Processing Speed: 2000-2200 sheets/hour

• Placement Accuracy: ±0.05mm

• Wire Embedding Resolution: ±0.1mm

• Chip Compatibility: 0.5×0.5mm to 3.0×3.0mm COB packages

• Substrate Thickness Range: 0.2-0.4mm

• Control System: Industrial PLC with servo coordination

• Operator Interface: 15-inch capacitive touchscreen

• File Compatibility: DXF, DWG, Gerber formats

• Operating Environment: 15-30°C, 30-70% RH

Industry Applications
The system serves manufacturers producing contactless payment cards, access control credentials, electronic passports, RFID inventory tags, and specialized IoT devices. Its precise parameter control makes it particularly suitable for security document production where consistency across large batches is paramount.

Implementation Considerations
Successful deployment typically requires cleanroom or controlled environment conditions (Class 100,000 recommended). The system interfaces with standard material handling equipment and supports integration into existing production lines. Preventive maintenance cycles of 2,000 operational hours ensure sustained performance, with most components accessible for service without specialized tools.

Technical Support
Installation includes comprehensive system calibration and operator training. Remote diagnostic capabilities allow technical support teams to monitor system performance and address potential issues proactively. Regular firmware updates ensure compatibility with emerging industry standards and material specifications.