Zowinda LDT-AFJX-1000: Technical Analysis of Integrated Chip Placement and Wire Embedding/Welding System

Product Positioning and Technical Background

In the modern contactless smart card and electronic passport manufacturing sector, traditional production processes typically require multiple separate equipment stages to complete chip placement, antenna embedding, and welding operations. This fragmented production model not only increases equipment footprint but also inevitably introduces precision errors and efficiency losses during process transitions. Zowinda's LDT-AFJX-1000 fully automated integrated equipment addresses these challenges by consolidating three core processes, offering a novel solution for inlay production technology.

Core Technical Features

1.Eight-Head Synchronized Placement System
The equipment utilizes eight independently controlled placement heads, coordinated with flexible vibration bowls for automatic chip orientation and feeding. Optical detection and position correction mechanisms within the vibration bowls ensure chips are properly aligned before reaching placement positions. The X-Y axes employ precision linear motor drives, achieving positioning accuracy of ±0.05mm, adaptable to various COB chip dimensions.

2.Ultrasonic Embedding Technology Application
Each of the eight ultrasonic wire embedding heads features an independent Z-axis servo control system, with embedding pressure adjustable within the 0.5-5N range. The vacuum adsorption platform incorporates multi-zone independent control to maintain substrate flatness during embedding. The system supports direct import of DXF format graphic files, allowing users to set segment-specific speeds and adjust jump wire heights between 0.1-1.0mm.

3.Welding Process Innovation
Four welding heads utilize dual-pulse high-frequency inverter welding technology, each driven by servo motors through ball screws for precise Z-axis movement. Welding parameters (including current, duration, and pressure) can be set independently for each row and column, particularly beneficial for handling different substrate materials (such as PVC, PET, and ABS).

Production Process Optimization

The most significant technological breakthrough lies in completely eliminating reliance on consumables like green tape used in conventional production. Through improved vacuum adsorption and mechanical positioning systems, damage-free substrate transfer between processes has been achieved. Verified data indicates this innovation reduces consumable costs by approximately ¥0.15 per inlay unit.

Automation and Flexible Production

The integrated automatic loading and unloading mechanisms employ modular design, supporting both reel-to-reel and sheet-to-sheet feeding modes. The processing area features interchangeable fixture plates, enabling rapid adaptation to various layout requirements including 3×8 and 4×8 configurations. Production specification changes can be completed within five minutes simply by recalling pre-set production recipes through the human-machine interface.

Performance Metrics and Verified Data

Third-party testing机构 verification confirms that during continuous 72-hour production tests, the equipment maintained stable output of 2,100 sheets per hour with a first-pass yield rate of 99.3%. Power consumption monitoring shows average operational power remains around 6.8kW under standard working conditions, representing approximately 25% energy savings compared to traditional separate equipment configurations.

Expandability and Maintenance

The equipment provides multiple expansion interfaces for subsequent integration of additional modules including online inspection, sorting, and spot welding functions. For maintenance, fully enclosed guide protection and automatic lubrication systems enable recommended preventive maintenance intervals of 2,000 operational hours.

Application Case Study

A European smart card manufacturer reported reducing their inlay production line footprint by 40% after implementing this equipment, while operator requirements decreased from three to one person per shift. Additionally, by eliminating semi-finished product handling between processes, the production cycle time was shortened by 65%.

Technical Outlook

With the proliferation of 5G and IoT technologies, demand for high-frequency and flexible inlays continues to grow. The process adaptability and expandability demonstrated by this equipment provide a reliable technological platform for future industrial production of new electronic packaging solutions.

Technical Specifications

Additional Technical Notes:

1.Production Speed:
The rated speed of 2000-2200 sheets/hour is based on standard 4×8 layout configuration with 0.3mm substrate thickness.

2.Accuracy Specifications:
Chip placement accuracy: Measured at 3σ under standard operating conditions
Wire embedding accuracy: Includes both positional and depth precision

3.Material Compatibility:
Substrates: PVC, ABS, PET, PETG, PC
Wire materials: Copper, aluminum, silver-coated copper
Chip types: COB, flip-chip, bare die

4.Utility Requirements:
Stable voltage supply with ±5% tolerance required
Compressed air must be oil-free and dry
Grounding resistance <4Ω

5.Customization Options:
Additional placement heads (up to 12)
Enhanced vision inspection systems
Automated optical inspection (AOI) integration
Custom material handling systems