ICC Backside Spot Pressure Tester - e-Passport Chip Module Adhesion Test
The ICC Backside Spot Pressure Tester (IBS-E) is a dedicated benchtop instrument designed, per CQM requirements, to perform the backside spot pressure test on e-passport inlays and secure smart cards. By this test we determine the adhesive strength between the embedded module and the card body.
The IBS-E works as the left-side unit together with the MPT-01 (right side). The MPT-01 first drills a precise opening in the card body to expose the module; the IBS-E then applies force directly to the reverse center side of the module through that opening, revealing any weak bonding before it becomes a field failure.
A poorly bonded chip module can detach during lamination, personalization, or in-service use. The IBS-E gives manufacturers a fast, repeatable pass/fail check at the 30 N threshold.
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Step 1 · Prepare
Insert the card into the MPT-01 to fix it in position, then drill an opening at the backside to expose the module. |
Step 2 · Test
Place the card on the P-24 stage and lower the tester head; descent shall happen at a speed < 30 mm/min. |
Step 3 · Judge
On the force gauge, rupture or detachment shall NOT happen at a force < 30 N. If it does, bonding fails. |
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1. Module Adhesion Verification
Measures the bonding strength between the inlay module and the card body, catching weak adhesion early. |
2. Paired with MPT-01
Left-side counterpart to the MPT-01, which drills the exact backside opening needed to expose the module. |
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3. Clear 30 N Criterion
Simple force-gauge threshold: no rupture or detachment below 30 N means module adhesion is acceptable. |
4. Calibration-Free
No calibration required — operators only need to keep the tester clean for consistent results. |
| Item | Value |
| Model Number | IBS-E |
| Description | ICC Backside Spot Pressure Tester |
| Test Function | Backside spot pressure / module-to-card-body adhesion test |
| Working Principle | Spot pressure on reverse center of module via MPT-01 opening |
| Companion Equipment | MPT-01 (opening preparation), P-24 (test stage) |
| Test Criterion | No module rupture or detachment at force < 30 N |
| Descent Speed | < 30 mm/min |
| Calibration | Not required; keep tester clean |
| Dimensions (L x W x H) | 235 × 190 × 380 mm |
| Net Weight | 7.6 kg |
The IBS-E supports chip-module adhesion qualification aligned with the relevant e-passport and secure-card frameworks:
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CQM Requirement
Designed according to CQM to perform the backside spot pressure test on e-passport inlays. |
ISO/IEC 10373-1
Identification cards — Test methods — General characteristics, covering module attachment and adhesion. |
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ICAO Doc 9303
e-Passport chip-module qualification framework — module integrity and bonding reliability. |
ISO/IEC 14443 / 7816
Contactless and contact module families for which module adhesion is critical. |
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ePassport Personalization Centers
Verify chip-module bonding after inlay embedding, lamination, and personalization. |
Secure Card Manufacturers
Incoming and in-process QC for ID cards and other ICAO-compliant secure documents. |
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Government Document Test Labs
Independent module-adhesion verification for procurement acceptance and audits. |
Third-Party Inspection Agencies
Fast, calibration-free pass/fail check of module bonding strength. |
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