Why Encapsulation Matters

The module sits at the most stressed point of the card. Without a stable encapsulant, thermal cycling and handling gradually crack the bond, lift the module, or break electrical contact. The right resin absorbs stress, fills the cavity, and locks the module for the card's service life.

Epoxy Encapsulation

Two-part epoxy is the traditional workhorse: high mechanical strength, excellent adhesion, and strong chemical resistance. Its downside is a longer cure time and rigidity - it transfers stress rather than absorbing it, so formulation matters for flexible cards.

Polyurethane (PU) Encapsulation

PU offers elastomeric flexibility and outstanding low-temperature performance, cushioning the module against impact and bending. It tolerates humidity well. The trade-off is slower cure and sensitivity to moisture during dispensing, which demands a controlled environment.

UV-Curable Resin

UV resin cures in seconds under light, enabling very high line speeds and precise dispensing. It is ideal for high-volume inline encapsulation. Limitations include shallow cure depth and the need for good surface wetting; shadowed areas may stay uncured.

Selection Guidance

Choose epoxy for maximum rigidity and adhesion, polyurethane where flexibility and impact resistance are critical, and UV resin when throughput dominates. Validate the chosen material against your card body and lamination profile to avoid delamination at the module edge.

Zowinda module implanting and encapsulation lines support epoxy, PU, and UV resin processes.

Key Advantages at a Glance

Technical Reference